Smiths Interconnect launches ‘DaVinci Gen V’ next-generation test socket

Delivers ultra-reliable testing of chips used in AI, 6G communications, and advanced computing applications

Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, today announced the launch of DaVinci Gen V, the latest flagship product in its DaVinci series portfolio.

The product rigorously tests semiconductor chips during the manufacturing process to ensure that they provide ultra-reliable and repeatable performance. These chips are used in a range of areas such as AI accelerators, automotive systems and next generation 6G communications networks. Not only are these use cases essential to everyday life, they are also expected to grow on a global scale  out over the next few years.

The DaVinci Gen V solves fundamental industry challenges of impedance tuning – an essential part of circuit design that enables maximum transfer of signal power – and signal integrity – the measurement of quality of an electrical signal as it travels through a circuit. By tackling these challenges, the DaVinci Gen V ensures reliable, ultra high performance in electronic systems and testing.

Brian Mitchell, Vice President of Smiths Interconnect’s Semiconductor Test Business Unit, said: "This innovation empowers semiconductor manufacturers to test faster, more reliably, and with greater precision – ensuring their products meet the demands of AI, 6G, and next-generation technologies. More than just a product, DaVinci Gen V embodies Smiths Interconnect’s commitment to advancing semiconductor testing through continuous innovation."

The technical specification

The product delivers breakthrough high-speed signal transmission performance. It enables unprecedented digital signaling speeds of up to 224 Gbps PAM4 for AI accelerators and beyond 100 GHz for 6G communications – these speeds are crucial for supporting the growing demand for massive data transfer. 

The product also supports the growing complexity of modern integrated circuits, accommodating a 40% increase in next generation ASIC (application specific integrated circuits) sizes. ASICs are powerful computer chips that combine several different circuits all on one chip, in a ‘system on a chip’ design.

As next-generation integrated circuits continue to evolve – doubling in bandwidth and computational power every two years – DaVinci Gen V is designed for seamless integration. It maintains full compatibility with existing test hardware, allowing manufacturers to transition effortlessly, reduce development cycles and accelerate time-to-market.

For more information, please visit www.smithsinterconnect.com

About Smiths Interconnect

Smiths Interconnect is a leading provider of high reliability connectivity products and solutions

serving segments of aerospace and defence, medical, semiconductor test, and industrial markets. It designs and manufactures technically differentiated electronic components, microwave, optical and radio frequency products and sub-systems that connect, protect and control critical applications.

Smiths Interconnect is part of Smiths Group. For over 170 years, Smiths has been pioneering progress by engineering a better future. We serve millions of people every year, to help create a safer, more efficient and productive, and better-connected world across four global markets: energy, safety & security, aerospace & defence, and general industrial. Listed on the London Stock Exchange, Smiths employs c.15,000 colleagues in over 50 countries. For more information visit www.smiths.com.